Flex PCB Assembly
Flexible FPC Board
Flex and rigid-flex circuit assembly for wearables, medical devices, cameras, drones and compact consumer electronics. 1–6 layer FPC with stiffener, EMI shielding and ZIF connector assembly.
Get a QuoteSpecifications
| Layers | 1 – 6 layers (rigid-flex 2–10) |
| Min. Trace/Space | 3/3 mil |
| Thickness | 0.06 – 0.25 mm (flex) |
| Stiffener | FR-4, PI, steel sheet |
| Finish | ENIG, immersion tin, OSP |
| Lead Time | Sample 48 h · mass 8–12 days |
| MOQ | 1 piece prototype |
| QC | 100% AOI + flex test |
Applications
- Wearables & medical
- Cameras & optical modules
- Drones & robotics
- Smartphones & consumer
FAQ
What layer counts for FPC?
1–6 layer flex standard; rigid-flex up to 10 layers.
Do you add stiffeners?
Yes, FR-4, PI and steel stiffeners for ZIF/connector areas.
Can you do EMI shielding film?
Yes, conductive shielding film and coverlay lamination available.