芯片工业周回顾

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$2B foundry pact; hyper-NA EUV; TSMC, Samsung financials; Canon readies nanoimprint; AI chips under scrutiny; $10T data center buildout; $1.5B SiC boost; chip smuggling; 800V power gains traction; quantum HW scales up; wireless EV road charging; sub-nm gate dielectrics; mobile fab. In-Depth Reports and Deals New Technologies Security Vehicles, Batteries Research Quantum Workforce | Education Events and Webinars Semiconductor Engineering published the Test, Measurement and Analytics newsletter, including: Qualcomm and Huawei signed a multi-year patent cross-licensing agreement covering 5G, compute, AI, and networking. Qualcomm will separately acquire certain Huawei U.S. patents, pending regulatory approval. A Cornell -led team developed silicon-doped α-(AlxGa1−x)₂O₃ with a bandgap exceeding 7 eV while maintaining n-type conductivity, and fabricated both a Schottky diode and transistor using the ultra-wide-bandgap material. “Our achievement breaks the trend of increasing synthesis difficulty, cost and small size of ever-wider-bandgap semiconductors, for example, diamond and cubic boron nitride,” the researchers wrote. UIUC, DOE’s NETL , and collaborators integrated a high-k oxide with 2D semiconductors using a carbon-dot monolayer as a van der Waals interface. The approach produced a smooth, stable gate dielectric with an equivalent oxide thickness of about 0.6 nm, low leakage and a high breakdown field, addressing a key challenge in scaling 2D transistors. The U.S. DOE awarded $159M to 12 AI-driven scientific research projects , including a Fermilab -led effort to accelerate the design of microchips for extreme environments and a Harvard -led project combining AI and quantum hardware to advance quantum error correction. Infineon debuted its new TRAVEO CYT4EN automotive MCU for high-performance instrument clusters and advanced cockpit graphics that could also be used in motorcycles. Samsung ’s System LSI division is reportedly halting its development of new automotive application processors amid cost pressures, Munhwa reported. Purdue University launched a mobile semiconductor fabrication lab that brings hands-on lithography, deposition, and etching training directly to students and aspiring technicians without requiring access to a full cleanroom. Cadence announced new Digital Badges, verified credentials issued through Credly , aimed at PCB and package design.