消费者和工业IoT驱动无线芯片市场

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The development of IoT devices for consumer and industrial markets continues to drive the need for next-generation wireless chips. At the same time, accelerating demand for Wi-Fi 6 and 7, Bluetooth 5.x/6 and Bluetooth Low Energy (LE), and edge AI applications are driving requirements for multi-protocol wireless system-on-chips (SoCs). The wireless connectivity chipset market size is forecast to grow from $9.3 billion in 2025 to $10 billion in 2026 and reach $14.6 billion by 2031, at a 7.72% compound annual growth rate over 2026–2031, according to Mordor Intelligence. Growth is attributed to the rapid integration of multi-protocol functionality into single-chip solutions, the increasing demand for edge AI processing, and a surge in automotive telematics. Here’s a sampling of several wireless chips introduced in 2026, targeting consumer and industrial IoT applications. They feature high integration, low power consumption, and advanced security features. Low power consumption is a key requirement for battery-powered IoT devices. Silicon Labs recently developed its lowest-power Bluetooth LE wireless SoC that also enables more capabilities with higher integration. The Series 2 BG2B builds on existing Series 2 devices , including the BG22 , BG24 , and BG27 , targeting applications such as secure ranging, asset tracking, electronic shelf labels (ESLs), smart homes, industrial monitoring, and vehicle diagnostics. The Bluetooth 6 SoC addresses the need for higher power efficiency, security, and integration and leverages the company’s lowest-power Bluetooth architecture with a feature set for Bluetooth Channel Sounding, Secure Vault High security, and integrated peripherals including CAN-FD, LED drivers, and dual ADCs. Silicon Labs said battery life is one of the biggest challenges for battery-powered IoT devices as products continue to add more sensing, intelligence, and wireless capabilities. Thanks to the BG2B device’s dual-output DC/DC power architecture and multi-core design, it can significantly improve efficiency across active, receive, and sleep modes, according to the company. The BG2B is the lowest-power Bluetooth LE device in Silicon Labs’ portfolio. It delivers 14% to 15% lower microcontroller (MCU) active current, lower Bluetooth receive current, and 1.1-µA EM2 sleep current with RAM retention, compared with the previous lowest-power Bluetooth LE SoC. By enabling longer battery life, it is suited for products such as wireless sensors, asset tags, smart locks, remotes, wearables, and ESLs. The wireless SoC supports advanced Bluetooth Channel Sounding capabilities, including Mode 3, Normalized Attack Detector Metric, and Inline Phase Correction Term for location-aware products. It meets Apple and Google Bluetooth Channel Sounding specifications, enabling interoperable products across leading mobile ecosystems, Silicon Labs said. The company’s Channel Sounding development solution includes a royalty-free ranging library, software, tools, and engineering support The BG2B delivers even lower energy per ranging event through shorter Channel Sounding step timings, lower active current, and lower Bluetooth LE receive current, according to Silicon Labs. The high integration of peripherals also helps reduce bill-of-materials cost and printed-circuit-board area. These peripherals include Bluetooth LE with integrated CAN-FD, enabling wireless diagnostics and monitoring for commercial vehicles, fleet management, industrial equipment, and maintenance applications without requiring a separate Bluetooth bridge device. The BG2B also integrates an LED boost and four-channel LED sink capabilities, eliminating the need for external LED driver circuitry; dual 12-bit ADCs for simultaneous analog sampling; and variable resistive load for more accurate battery health estimation. It also packs expanded memory and a broad set of communication peripherals. Security features include Silicon Labs’ Secure Vault technology to protect device id